THE FOLLOWING IS A QUOTE FROM THIS BOOK
The Mechanics of Solder Alloy INTERCONNECTS
Edited by D.R. Frear, S.N. Burchett, H.S. Morgan, J.H. Lau
“The composition of a solder is chosen so that it forms a strong bond to the metal surfaces it is intended to join. Bonding is promoted by chemical reactions between the solder and the substrate that form intermetallic compounds.”
Van Nostrand Reinhold, Copyright 1994.
CHIP COMP
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