ELECTRONICS MANUFACTURING

THE FOLLOWING IS A QUOTE FROM THIS BOOK The Mechanics of Solder Alloy INTERCONNECTS Edited by D.R. Frear, S.N. Burchett, H.S. Morgan, J.H. Lau “The composition of a solder is chosen so that it forms a strong bond to the metal surfaces it is intended to join. Bonding is promoted by chemical reactions between the… Continue reading ELECTRONICS MANUFACTURING